Title:
FIBER-REINFORCED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/189755
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a fiber-reinforced substrate having a resin material layer containing thermoplastic resin fibers, the fiber-reinforced substrate being such that the generation of microcracks originating in the resin material layer is reduced. The present invention relates to a fiber-reinforced substrate 30 having one or a plurality of reinforcing fiber layers 330, 340, 350 containing reinforcing fibers, one or a plurality of resin material layers 310-316 containing thermoplastic resin fibers, and supplementary yarns. The supplementary yarns link together the reinforcing fibers and/or the reinforcing fiber layers, thereby maintaining unity in the reinforcing fiber layers and/or in the fiber-reinforced substrate. The average fiber diameter of the thermoplastic resin fibers is 0.5-35 μm.
Inventors:
OSAKI KOHEI (JP)
NAKAGAWA HIROKI (JP)
NAKAGAWA HIROKI (JP)
Application Number:
PCT/JP2023/010677
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
TEIJIN LTD (JP)
International Classes:
B32B5/26; B29B11/16; B32B7/09; D04H3/04
Domestic Patent References:
| WO2021172246A1 | 2021-09-02 |
Foreign References:
| JP2005313607A | 2005-11-10 | |||
| JP2019099987A | 2019-06-24 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Download PDF: