Title:
FILTER CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/051570
Kind Code:
A1
Abstract:
A filter circuit packaging structure and a manufacturing method therefor. The filter circuit packaging structure comprises: a capacitor chip (110), a plastic packaging layer (120), at least one first circuit layer (130) and at least one second circuit layer (410); the plastic packaging layer (120) covers the capacitor chip (110), the first circuit layer (130) and the second circuit layer (410); the second circuit layer (410) is electrically connected to the first circuit layer (130), and the first circuit layer (130) and/or the second circuit layer (410) are configured to form at least one inductive element; the capacitor chip (110) is arranged between the first circuit layer (130) and the second circuit layer (410); and the inductive element is connected to the capacitor chip (110).
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Inventors:
ZUO CHENGJIE (CN)
HE JUN (CN)
WANG XIAODONG (CN)
HE CHENGGONG (CN)
CHENG WEI (CN)
HE JUN (CN)
WANG XIAODONG (CN)
HE CHENGGONG (CN)
CHENG WEI (CN)
Application Number:
PCT/CN2023/116188
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
ANHUI ANUKI TECH CO LTD (CN)
International Classes:
H01L23/64; H01L23/31; H01L23/488
Foreign References:
| CN115458511A | 2022-12-09 | |||
| US20200075491A1 | 2020-03-05 | |||
| CN111834341A | 2020-10-27 | |||
| CN113517270A | 2021-10-19 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF:
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