Title:
FLEXIBLE MULTI-LAYER SUBSTRATE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/123996
Kind Code:
A1
Abstract:
Provided are: a flexible multi-layer substrate which has a flexible structure and can support high speed transfers; and a manufacturing method therefor. A flexible multi-layer substrate (100) comprises: a flexible substrate (110) including wiring (11a), a terminal region (51a), and a connection region (52a); and a flexible substrate (120) including wiring (11b), a terminal region (51b), and a connection region (52b). The terminal regions (51a, 51b) are joined so as to be insertable into a card edge connector, through an insulation reinforcement board (130). The connection regions (52a, 52b) are joined at a position that is separated from the terminal regions (51a, 51b) with a bendable flexible part (30) therebetween, and are electrically connected through a via (13).
Inventors:
TAKEDA MASAHIRO (JP)
YUKAWA YUSUKE (JP)
INAMI EIJI (JP)
YUKAWA YUSUKE (JP)
INAMI EIJI (JP)
Application Number:
PCT/JP2021/041459
Publication Date:
June 16, 2022
Filing Date:
November 11, 2021
Export Citation:
Assignee:
YAMASHITA MAT CORPORATION (JP)
International Classes:
H05K1/14
Foreign References:
| JPS62120097A | 1987-06-01 | |||
| JPH10107178A | 1998-04-24 | |||
| JPH05129746A | 1993-05-25 | |||
| JPH06268348A | 1994-09-22 | |||
| JP2002100842A | 2002-04-05 | |||
| JP2007234500A | 2007-09-13 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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