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Patent Searching and Data


Title:
FLEXIBLE SENSOR, AND METHOD FOR MANUFACTURING FLEXIBLE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/145220
Kind Code:
A1
Abstract:
A flexible sensor (10) comprises: a flexible main substrate (21); a support substrate (28) that is flexible, is formed from a material of which at least an outer surface is electrically insulating, and is provided on the main substrate (21); and a variable resistance portion (24) which has a resistance value that changes in accordance with distortion thereof, and which is provided on a first surface (28a) on the opposite side of the support substrate (28) to the main substrate (21).

Inventors:
KANAZAWA SHUSUKE (JP)
ITAGAKI MOTOSHI (JP)
KOIZUMI SHOHEI (JP)
KITO YOSHIAKI (JP)
HATAYAMA KATSUHIRO (JP)
SHIM CHANGHOON (JP)
Application Number:
PCT/JP2022/043157
Publication Date:
August 03, 2023
Filing Date:
November 22, 2022
Export Citation:
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Assignee:
AIST (JP)
NIKON CORP (JP)
International Classes:
G01L1/18; G01L5/00
Foreign References:
JP2020085613A2020-06-04
JP2016121974A2016-07-07
JP2021117032A2021-08-10
CN111883556A2020-11-03
US20180247994A12018-08-30
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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