Title:
GOLD-COATED SILVER BONDING WIRE, METHOD FOR PRODUCING SAME, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/208839
Kind Code:
A1
Abstract:
Provided is a gold-coated silver bonding wire which can suppress a short circuit based on ionic migration between ball compression units. A gold-coated silver bonding wire 1 is provided to a core material 2 containing silver as a main component, and the surface of the core material 2, and has a coating layer 3 containing gold as a main component. The gold-coated silver bonding wire 1 contains gold in the range of 2-7 mass% with respect to the total amount of the wire, and includes at least one sulfur group element selected from among sulfur, selenium, and tellurium, in the range of 1-80 mass ppm.
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Inventors:
ANTOKU YUKI (JP)
KAWANO SHOTA (JP)
SAKITA YUSUKE (JP)
KAWANO SHOTA (JP)
SAKITA YUSUKE (JP)
Application Number:
PCT/JP2019/030377
Publication Date:
October 15, 2020
Filing Date:
August 01, 2019
Export Citation:
Assignee:
TANAKA ELECTRONICS IND (JP)
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522
Foreign References:
| US20180026004A1 | 2018-01-25 | |||
| JP2001196411A | 2001-07-19 | |||
| JP2016115875A | 2016-06-23 | |||
| JP2019052375A | 2019-04-04 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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