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Title:
HEAT-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/190324
Kind Code:
A1
Abstract:
A heat-conductive resin composition which is characterized by comprising at least (A) a thermoplastic resin in an amount of 30 to 90% by mass and (B) flake graphite in an amount of 10 to 70% by mass, and also characterized by having a specific gravity of 1.4 to 2.0 and an in-plane heat conductivity of 1 W/(m·K) or more, wherein the volume average particle diameter of flake graphite (B) is 201 to 700 μm, the fixed carbon content in flake graphite (B) is 98% by mass or more and the aspect ratio of flake graphite (B) is 21 or more in a molded article made from the resin composition.

Inventors:
EZAKI TOSHIAKI (JP)
UCHIDA SOICHI (JP)
MATSUMOTO KAZUAKI (JP)
Application Number:
PCT/JP2015/065662
Publication Date:
December 17, 2015
Filing Date:
May 29, 2015
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/00; C08K3/04; C08K7/00; C09K5/14
Domestic Patent References:
WO2014024743A12014-02-13
WO2013133181A12013-09-12
WO2013099089A12013-07-04
WO2006126606A12006-11-30
WO2008015775A12008-02-07
WO2008062844A12008-05-29
Foreign References:
JP2014078335A2014-05-01
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
Takao Yanagino (JP)
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