Title:
HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/027303
Kind Code:
A1
Abstract:
The present application provides a heat dissipation device and an electronic apparatus, which are used for improving the efficiency of heat conduction between the heat dissipation device and a hard disk, thereby improving the heat dissipation performance. The heat dissipation device comprises a heat sink and a plurality of heat conduction components. The plurality of heat conduction components are all connected to the heat sink and spaced apart from each other. A slot is formed between two adjacent heat conduction components and used for receiving a hard disk.
Inventors:
JIA HUI (CN)
WANG CHENGLONG (CN)
WANG CHENGLONG (CN)
Application Number:
PCT/CN2023/096646
Publication Date:
February 08, 2024
Filing Date:
May 26, 2023
Export Citation:
Assignee:
XFUSION DIGITAL TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN214410780U | 2021-10-15 | |||
| CN107146924A | 2017-09-08 | |||
| CN114115470A | 2022-03-01 | |||
| CN209358905U | 2019-09-06 | |||
| CN215600094U | 2022-01-21 | |||
| CN216697261U | 2022-06-07 | |||
| CN216697262U | 2022-06-07 | |||
| CN217086135U | 2022-07-29 |
Attorney, Agent or Firm:
E-TONE INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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