Title:
HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/230296
Kind Code:
A1
Abstract:
A vapor chamber 1 that is an embodiment of a heat dissipation device includes an enclosure 10 that has a first inner wall face 11a and a second inner wall face 12a facing each other in a thickness direction, a working medium 20 sealed in an inner space of the enclosure 10, and a plurality of wicks 30 disposed in the inner space of the enclosure 10. Each of the plurality of wicks 30 follows a direction perpendicular to the thickness direction, and has a portion that comes into contact with the first inner wall face 11a and the second inner wall face 12a of the enclosure 10. A vapor channel 50 is formed in the inner space of the enclosure 10. A capillary structure 70 spanning among the plurality of wicks 30 is further provided in the inner space of the enclosure 10.
Inventors:
NUMOTO TATSUHIRO (JP)
KOJIMA KEIJIRO (JP)
MUKAI TSUYOSHI (JP)
MORIKAMI MASASHI (JP)
KOJIMA KEIJIRO (JP)
MUKAI TSUYOSHI (JP)
MORIKAMI MASASHI (JP)
Application Number:
PCT/JP2022/005071
Publication Date:
November 03, 2022
Filing Date:
February 09, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/427; F28D15/02; F28D15/04; H05K7/20
Foreign References:
JPH08303971A | 1996-11-22 | |||
JP2018185110A | 2018-11-22 | |||
JP3214513U | 2018-01-18 | |||
US20170160017A1 | 2017-06-08 | |||
US20100051239A1 | 2010-03-04 | |||
JP2008153423A | 2008-07-03 | |||
US20060213648A1 | 2006-09-28 | |||
JP2016023821A | 2016-02-08 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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