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Patent Searching and Data


Title:
HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/045429
Kind Code:
A1
Abstract:
The present application discloses a heat dissipation device. The heat dissipation device comprises: a seat assembly, a liquid inlet cavity being disposed inside the seat assembly, and the liquid inlet cavity being configured to accommodate a refrigerant; a guide toothed sheet assembly, disposed in the liquid inlet cavity; and a heat dissipation toothed sheet, disposed on the seat assembly and extending in a vertical direction, a passage being provided in the heat dissipation toothed sheet, the passage having a top end and a bottom end, and the bottom end of the passage being in communication with the liquid inlet cavity. The seat assembly is configured such that when a position where the seat assembly is attached to a chip is heated, heat is transferred to the liquid inlet cavity via the seat assembly, so that the refrigerant in the liquid inlet cavity is boiled and vaporized to form a gaseous refrigerant. The passage is configured such that the gaseous refrigerant enters the top end through the passage to condense to form a liquid refrigerant, so that the liquid refrigerant can flow back to the liquid inlet cavity through the passage.

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Inventors:
MENG XILING (CN)
LI TING (CN)
ZHOU WEI (CN)
RONG CHAOYUN (CN)
DENG NANJIAN (CN)
ZHANG WEI (CN)
HUANG JINGWEI (CN)
Application Number:
PCT/CN2022/099196
Publication Date:
March 30, 2023
Filing Date:
June 16, 2022
Export Citation:
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Assignee:
SHANGHAI ACCURACY & INTELLIGENCE CO LTD (CN)
International Classes:
F28D15/02; H05K7/20
Foreign References:
CN113865393A2021-12-31
CN213208737U2021-05-14
JP3218376U2018-10-11
CN110779365A2020-02-11
CN202485512U2012-10-10
JP2020038051A2020-03-12
CN111912274A2020-11-10
CN208063649U2018-11-06
CN110243223A2019-09-17
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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