Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HOLLOW MICROBALLOONS FOR CMP POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2021/201088
Kind Code:
A1
Abstract:
These hollow microballoons for a CMP polishing pad have an average particle size of 1-100 μm, and are formed from at least one resin selected from the group consisting of melamine resins, urea resins, and amide resins.　According to the present invention, it is possible to provide hollow microballoons for a CMP polishing pad, whereby excellent polishing characteristics can be exhibited when used in a CMP polishing pad and, during CMP polishing pad production, CMP polishing pads can be produced in a stable manner.

Inventors:
SHIMIZU YASUTOMO (JP)
KAWASAKI TAKAYOSHI (JP)
Application Number:
PCT/JP2021/013796
Publication Date:
October 07, 2021
Filing Date:
March 31, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKUYAMA CORP (JP)
International Classes:
B24B37/24; C08G18/00; C08G18/42; C08J9/32; C08K5/3492; C08L23/26; H01L21/304
Domestic Patent References:
WO2019198675A12019-10-17
WO2015098586A12015-07-02
Foreign References:
JPS6019033A1985-01-31
JP2017177301A2017-10-05
JP2019063903A2019-04-25
JP2015096293A2015-05-21
JP2020040129A2020-03-19
JP2017100215A2017-06-08
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD FOR PRODUCING MULTISPECIFIC ANTIGEN-BINDING MOLECULES

Next Patent: HOLLOW MICROBALLOONS