Title:
IC SHEET, AND PASSPORT AND CONTACTLESS IC CARD WITH IC SHEET
Document Type and Number:
WIPO Patent Application WO/2024/004922
Kind Code:
A1
Abstract:
According to the present invention, even if polycarbonate is selected as the material for the cover sheet in an IC sheet consisting of an inlet and cover sheets disposed above and below the inlet, it is possible to reliably prevent the cover sheet from peeling off from the inlet while productivity does not decrease. An IC sheet 1 of the present invention includes an inlet 2 consisting of an IC chip 7, an antenna 8 connected to the IC chip 7, and a carrier sheet 10 made of nonwoven fabric that holds these IC chips 7 and the antenna 8, and cover sheets 3 and 4 made of polycarbonate disposed on the lower side and the upper side of the inlet 2. The cover sheets 3 and 4 and the carrier sheet 10 are integrated by solidifying the polycarbonate resin constituting the cover sheets 3 and 4 while entering between the fibers of the nonwoven fabric of the support sheet 10.
Inventors:
OAE KOJI (JP)
KAMEDA YOSHIKAZU (JP)
KAMEDA YOSHIKAZU (JP)
Application Number:
PCT/JP2023/023520
Publication Date:
January 04, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
MAXELL LTD (JP)
International Classes:
G06K19/077; B42D25/24; B42D25/305; G06K19/02
Domestic Patent References:
| WO2018151238A1 | 2018-08-23 |
Foreign References:
| JP2000113151A | 2000-04-21 | |||
| JP2020124927A | 2020-08-20 | |||
| JP2006309603A | 2006-11-09 | |||
| JP2000091494A | 2000-03-31 | |||
| JPH10129165A | 1998-05-19 | |||
| JP2011079285A | 2011-04-21 | |||
| JP2022045715A | 2022-03-22 | |||
| JP2000113142A | 2000-04-21 | |||
| JPS62134295A | 1987-06-17 |
Attorney, Agent or Firm:
MORIMOTO Satoshi (JP)
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