Title:
INSULATING MATERIAL, PROCESS FOR PRODUCING ELECTRONIC PART/DEVICE, AND ELECTRONIC PART/DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/129662
Kind Code:
A1
Abstract:
An insulating material giving a cured object which is less apt to suffer dielectric
breakdown and excellent in resistance to thermal cycling and high-temperature
standing resistance; an electronic part/device; and a process for producing
the part/device. The insulating material comprises a curable compound (a),
a hardener (b), a high-molecular polymer having an aromatic skeleton, and an
inorganic filler (e) in specific proportions, wherein the curable compound
(a) is either a curable compound having two or more epoxy groups per molecule and
a polycyclic aromatic hydrocarbon skeleton (a1) as at least part of the main chain
or a curable compound having two or more epoxy groups per molecule and, as at least
part of the main chain, a skeleton (a2) comprising two or more aromatic rings directly
bonded through a single bond and the proportion of the skeleton (a1) or skeleton
(a2) in all skeletons of the curable compound (a) is 30 wt.% or higher. The electronic
part/device (1) has an insulating layer (4) formed from the insulating material.
Inventors:
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
WATANABE TAKASHI (JP)
AOYAMA TAKUJI (JP)
WATANABE TAKASHI (JP)
Application Number:
PCT/JP2007/059377
Publication Date:
November 15, 2007
Filing Date:
May 02, 2007
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
WATANABE TAKASHI (JP)
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
WATANABE TAKASHI (JP)
International Classes:
C08L63/00; C08G59/20; H01L21/60; H01L23/29; H01L23/31
Foreign References:
JP2003286390A | 2003-10-10 | |||
JP2006028274A | 2006-02-02 | |||
JP2005154727A | 2005-06-16 | |||
JP2003012888A | 2003-01-15 | |||
JP2000001610A | 2000-01-07 | |||
JP2001207065A | 2001-07-31 | |||
JP2002363255A | 2002-12-18 | |||
JP2003064153A | 2003-03-05 | |||
JP2003218407A | 2003-07-31 | |||
JP2003286391A | 2003-10-10 |
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (5-4 Tanimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 12, JP)
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