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Patent Searching and Data


Title:
INSULATING MATERIAL, PROCESS FOR PRODUCING ELECTRONIC PART/DEVICE, AND ELECTRONIC PART/DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/129662
Kind Code:
A1
Abstract:
An insulating material giving a cured object which is less apt to suffer dielectric breakdown and excellent in resistance to thermal cycling and high-temperature standing resistance; an electronic part/device; and a process for producing the part/device. The insulating material comprises a curable compound (a), a hardener (b), a high-molecular polymer having an aromatic skeleton, and an inorganic filler (e) in specific proportions, wherein the curable compound (a) is either a curable compound having two or more epoxy groups per molecule and a polycyclic aromatic hydrocarbon skeleton (a1) as at least part of the main chain or a curable compound having two or more epoxy groups per molecule and, as at least part of the main chain, a skeleton (a2) comprising two or more aromatic rings directly bonded through a single bond and the proportion of the skeleton (a1) or skeleton (a2) in all skeletons of the curable compound (a) is 30 wt.% or higher. The electronic part/device (1) has an insulating layer (4) formed from the insulating material.

Inventors:
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
WATANABE TAKASHI (JP)
Application Number:
PCT/JP2007/059377
Publication Date:
November 15, 2007
Filing Date:
May 02, 2007
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
WATANABE TAKASHI (JP)
International Classes:
C08L63/00; C08G59/20; H01L21/60; H01L23/29; H01L23/31
Foreign References:
JP2003286390A2003-10-10
JP2006028274A2006-02-02
JP2005154727A2005-06-16
JP2003012888A2003-01-15
JP2000001610A2000-01-07
JP2001207065A2001-07-31
JP2002363255A2002-12-18
JP2003064153A2003-03-05
JP2003218407A2003-07-31
JP2003286391A2003-10-10
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (5-4 Tanimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 12, JP)
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