LAMINATED FILM AND FILM LAMINATE

WIPO Patent Application WO/2023/120634

A1

Provided is a laminated film comprising a cured resin layer on one surface of a substrate film (A), wherein: the cured resin layer has an uneven structure; the arithmetic mean height (Sa) of the surface of the cured resin layer is at least 500 nm; and, in a distribution curve obtained from a surface profile obtained from a surface observation of the cured resin layer by a white light interference microscope, where the horizontal axis is the protrusion height (X) and the vertical axis is the common logarithmic value log(Y) of the number (Y) of protrusions, the cured resin layer satisfies formula (1). (In the formula, log(Y)max represents the value where the common logarithm of the number of protrusions is at a maximum and Xmax represents the positive protrusion height when the common logarithm of the number of protrusions is at a maximum. Also, log(Y)85% represents the value where the common logarithm of the number of protrusions is 85% of the maximum value and X85% represents the positive protrusion height when the common logarithm of the number of protrusions is 85% of the maximum value.)

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ADACHI DAISUKE (JP)
MIYAKE JUNICHI (JP)
FUKUOKA HIROYUKI (JP)
SATO YOSHIHIDE (JP)

PCT/JP2022/047316

June 29, 2023

December 22, 2022

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MITSUBISHI CHEM CORP (JP)

B32B3/30; C09J7/38; C09J133/00; C09J175/04; C09J183/04

JP2021024926A	2021-02-22
JP2022025620A	2022-02-10

TAGUCHI, Masahiro et al. (JP)

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