LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

WIPO Patent Application WO/2023/281840

A1

The laser processing device according to the one embodiment comprises: a laser light source; a stage; a fθ lens; a galvano scanner that scans laser light on a surface to be processed of a processing subject by operating a dielectric mirror and thereby adjusting the incidence angle of the laser light to the fθ lens; a polarizing beam splitter arranged between the laser light source and the galvano scanner in the light path of the laser light; a quarter-wave plate arranged between the polarizing beam splitter and the galvano scanner in the light path; and a light detection unit that detects return light of the laser light from the surface to be processed irradiated with the laser light, said return light traveling through the fθ lens, the galvano scanner, the quarter-wave plate, and the polarizing beam splitter in the stated order.

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TAKEDA AKIRA (JP)
FUKUOKA HIROTAKE (JP)

PCT/JP2022/012328

January 12, 2023

March 17, 2022

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HAMAMATSU PHOTONICS KK (JP)

B23K26/00; B23K26/064; B23K26/082; G02B26/10

JPH1085976A	1998-04-07
JP2001340980A	2001-12-11
JPH09216087A	1997-08-19
JPH11170074A	1999-06-29
JP2007284288A	2007-11-01

HASEGAWA Yoshiki et al. (JP)

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