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Title:
LEAD-FREE SOLDER ALLOY FOR USE IN TERMINAL PREPLATING, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/035879
Kind Code:
A1
Abstract:
　Provided is a lead-free solder alloy for use on a terminal, said alloy having improved shedding when a terminal part is withdrawn from within molten solder. This lead-free solder alloy for use in terminal preplating comprises to 4 to 6% by mass of Cu, 0.1 to 0.2% by mass of Ni, 0.01 to 0.04% by mass of Ga, and 0.004 to 0.03% by mass of P, the total amount of Ga and P not exceeding 0.05% by mass, and the remainder comprising Sn. Upon melting after having been heated to the soldering temperature, said alloy has a tensile strength of 200 dyn/cm or less.

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Inventors:
YOSHIKAWA SHUNSAKU (JP)
Application Number:
PCT/JP2015/075179
Publication Date:
March 10, 2016
Filing Date:
September 04, 2015
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; C22C13/00; H01F27/28; H05K3/34
Foreign References:
CN103406687A2013-11-27
JP2004181485A2004-07-02
JP2004154864A2004-06-03
JPH1192997A1999-04-06
Other References:
See also references of EP 3189929A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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