Title:
LED SEALANT
Document Type and Number:
WIPO Patent Application WO/2023/248952
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an LED sealant which can be applied with high precision and a cured product of which can conform to expansion and contraction of an LED chip and bending of a substrate. The present invention is a LED sealant comprising a curable resin and a polymerization initiator, wherein viscosity at 25°C is not more than 100 mPa·s, and tensile breaking elongation of a cured product at 25°C is not less than 50%.
Inventors:
UCHINO SHINYA (JP)
Application Number:
PCT/JP2023/022448
Publication Date:
December 28, 2023
Filing Date:
June 16, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L33/56; C09K3/10
Domestic Patent References:
| WO2020241368A1 | 2020-12-03 | |||
| WO1999054373A1 | 1999-10-28 |
Foreign References:
| JP2009193995A | 2009-08-27 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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