Title:
Li-CONTAINING OXIDE TARGET ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/178382
Kind Code:
A1
Abstract:
Provided is a Li-containing oxide target assembly which is produced by bonding a Li-containing oxide sputtering target to an Al-based or Cu-based backing plate through a bonding material, and which does not undergo the occurrence of warpage or breakage during the bonding. The Li-containing oxide target assembly according to the present invention is produced by bonding a Li-containing oxide sputtering target to a backing plate through a bonding material, and has bending strength of 20 MPa or more.
Inventors:
TAKETOMI YUICHI
KANAMARU MORIYOSHI
YOSHIDA SHINTARO
KANAMARU MORIYOSHI
YOSHIDA SHINTARO
Application Number:
PCT/JP2014/061894
Publication Date:
November 06, 2014
Filing Date:
April 28, 2014
Export Citation:
Assignee:
KOBELCO RES INST INC (JP)
International Classes:
C23C14/34; C04B37/02
Domestic Patent References:
| WO2011086650A1 | 2011-07-21 | |||
| WO2008012970A1 | 2008-01-31 | |||
| WO2008012970A1 | 2008-01-31 |
Foreign References:
| JP2001026863A | 2001-01-30 |
Other References:
See also references of EP 2993250A4
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
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