Title:
MEMS AND METHOD OF MANUFACTURING MEMS
Document Type and Number:
WIPO Patent Application WO2003016205
Kind Code:
A3
Abstract:
The present invention relates to micro electro-mechanical systems (MEMS) and production methods thereof, and more particularly to vertically integrated MEMS systems. Manufacturing of MEMS and vertically integrated MEMS is facilitated by forming, preferably on a wafer level, plural MEMS on a MEMS layer selectively bonded to a substrate, and removing the MEMS layer intact.
Inventors:
FARIS SADEG M (US)
Application Number:
PCT/US2002/026090
Publication Date:
February 12, 2004
Filing Date:
August 15, 2002
Export Citation:
Assignee:
REVEO INC (US)
FARIS SADEG M (US)
FARIS SADEG M (US)
International Classes:
B81B7/02; B81C1/00; H01L23/52; H01L49/00; (IPC1-7): B81C1/00; B81C5/00; H01L21/78
Foreign References:
| FR2771852A1 | 1999-06-04 | |||
| US3764950A | 1973-10-09 | |||
| EP0938129A1 | 1999-08-25 |
Other References:
GUI C ET AL: "SELECTIVE WAFER BONDING BY SURFACE ROUGHNESS CONTROL", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ELECTROCHEMICAL SOCIETY. MANCHESTER, NEW HAMPSHIRE, US, vol. 148, no. 4, 2001, pages g225 - g228, XP001090843, ISSN: 0013-4651
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