Title:
METAL MATERIAL FOR ELECTRIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2004/050950
Kind Code:
A1
Abstract:
A metal material for electric electronic components having a resin film on a part of a metal base is disclosed. An electric electronic component using this metal material is also disclosed.
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JPH05166854 | SEMICONDUCTOR DEVICE |
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Inventors:
TANI TOSHIO (JP)
SUZUKI SATOSHI (JP)
MESAKI MASAKAZU (JP)
SUZUKI SATOSHI (JP)
MESAKI MASAKAZU (JP)
Application Number:
PCT/JP2003/015467
Publication Date:
June 17, 2004
Filing Date:
December 03, 2003
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
TANI TOSHIO (JP)
SUZUKI SATOSHI (JP)
MESAKI MASAKAZU (JP)
TANI TOSHIO (JP)
SUZUKI SATOSHI (JP)
MESAKI MASAKAZU (JP)
International Classes:
H01L23/14; H05K9/00; (IPC1-7): C23C26/00; H01L23/02; H05K5/00
Foreign References:
JPH09300529A | 1997-11-25 | |||
JPH11354382A | 1999-12-24 |
Other References:
See also references of EP 1568799A4
Attorney, Agent or Firm:
Iida, Toshizo (1-10 Shimbashi 3-chom, Minato-ku Tokyo, JP)
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