Title:
METAMATERIAL SUBSTRATE, METAMATERIAL, AND LAMINATE BODY
Document Type and Number:
WIPO Patent Application WO/2023/162660
Kind Code:
A1
Abstract:
Provided is a metamaterial substrate comprising a compound that can bond with at least one among a conductive material and a material that changes from a non-conductor to a conductor. Also provided are a laminate body and a metamaterial provided with the metamaterial substrate.
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Inventors:
SASADA YASUYUKI (JP)
Application Number:
PCT/JP2023/003880
Publication Date:
August 31, 2023
Filing Date:
February 06, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01P1/00; B32B15/08; C08K5/00
Foreign References:
| JP2017175201A | 2017-09-28 | |||
| JP2017108378A | 2017-06-15 | |||
| JP2015045708A | 2015-03-12 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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