METHOD FOR COOLING SEMICONDUCTOR COMPONENT, AND HEAT DISSIPATION FILM FOR SEMICONDUCTOR COMPONENT

Title:

METHOD FOR COOLING SEMICONDUCTOR COMPONENT, AND HEAT DISSIPATION FILM FOR SEMICONDUCTOR COMPONENT

Document Type and Number:

WIPO Patent Application WO/2023/080350

Kind Code:

A1

Abstract:

The present application relates to a method for cooling a semiconductor component, comprising a step of positioning a metal layer between a semiconductor component and a heat dissipation coating layer, wherein the heat dissipation coating layer is formed from a heat dissipation paint composition comprising a urethane binder resin. The method of the present application enables a heat dissipation effect on a semiconductor component to be obtained.

More Like This:

JPH0783069	INDUSTRIAL APPLICABILITY: Semiconductor device and method for manufacturing the same.
WO/2020/259957	SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
JP2544761	[Name of invention] Heat sink for semiconductor laser

Inventors:

KIM TAE HAN (KR)
LEE SANG HUN (KR)
CHOI SANG IL (KR)
SIM YOUNG HUN (KR)
SONG JIN HO (KR)

Application Number:

PCT/KR2022/003163

Publication Date:

May 11, 2023

Filing Date:

March 07, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

PUREMANN INC (KR)

International Classes:

H01L23/373; C09D7/61; C09D175/04; C09J7/29

Foreign References:

KR20170017719A	2017-02-15
KR20150144371A	2015-12-28
JP2004343035A	2004-12-02
KR20110117751A	2011-10-28
KR20140147719A	2014-12-30

Attorney, Agent or Firm:

SEOHAN INTELLECTUAL PROPERTY LAW FIRM (KR)

Download PDF:

View/Download PDF PDF Help

Previous Patent: ONE-PART TYPE URETHANE HEAT-DISSIPATING PAINT COMPOSITION AND METHOD FOR PREPARING SAME

Next Patent: AUTOMATIC LIQUID FRACTIONATION APPARATUS FOR COLUMN CHROMATOGRAPHY