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Title:
METHOD FOR FILTERING POLISHING-ADDITIVE-CONTAINING LIQUID, POLISHING-ADDITIVE-CONTAINING LIQUID, POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND FILTER
Document Type and Number:
WIPO Patent Application WO/2021/024899
Kind Code:
A1
Abstract:
Provided is a method for filtering a polishing-additive-containing liquid with which it is possible to implement a polishing composition that shows exceptional defect reduction performance while maintaining a practical filter life. The method for filtering a polishing-additive-containing liquid provided by the present invention includes a step for filtering the polishing-additive-containing liquid using a filter that satisfies the following conditions (1) and (2). (1) The average pore diameter P measured by a palm porometer is 0.15 μm or less. (2) The pore diameter gradient (Sin/Sout), which is the ratio of an inlet-side average pore diameter Sin and an outlet-side average pore diameter Sout measured by SEM observation, is 3 or less.

Inventors:
FURUTA SHINJI (JP)
HAYAKAWA TAKASHI (JP)
ASHITAKA KEIJI (JP)
MIWA NAOYA (JP)
TSUCHIYA KOHSUKE (JP)
TANSHO HISANORI (JP)
AKIZUKI REIKO (JP)
Application Number:
PCT/JP2020/029203
Publication Date:
February 11, 2021
Filing Date:
July 30, 2020
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
B24B57/02; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
WO2011108418A12011-09-09
Foreign References:
JP2016089297A2016-05-23
JP2014173013A2014-09-22
JP2012044056A2012-03-01
Attorney, Agent or Firm:
ABE, Makoto (JP)
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