Title:
METHOD FOR FORMING ACTIVE COATING FILM ON SOLDER PARTICLES
Document Type and Number:
WIPO Patent Application WO/2024/034788
Kind Code:
A1
Abstract:
A method for forming an active coating film on solder particles of the present invention comprises the steps of: introducing solder particles and a solvent into a stirrer and cleaning same; adding an additional activator to the stirrer and compressing and forming an active coating film on the surface of the solder particles by collision of the falling solder particles; and removing the solvent from the solder particles and drying same.
Inventors:
KIM JUNG HO (KR)
Application Number:
PCT/KR2023/006808
Publication Date:
February 15, 2024
Filing Date:
May 19, 2023
Export Citation:
Assignee:
O COMPANY CO LTD (KR)
International Classes:
H05K3/34; H01L23/00
Foreign References:
| JP2000317682A | 2000-11-21 | |||
| JP2011104634A | 2011-06-02 | |||
| KR20130099003A | 2013-09-05 | |||
| JPH1147978A | 1999-02-23 | |||
| JP2003170294A | 2003-06-17 | |||
| KR102489828B1 | 2023-01-18 |
Attorney, Agent or Firm:
ECM IP & LAW FIRM (KR)
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