Title:
SOLDER PARTICLES HAVING ACTIVE COATING FORMED THEREON, MIXTURE FOR MANUFACTURING FILM FOR CONNECTION INCLUDING SAME, AND FILM FOR CONNECTION
Document Type and Number:
WIPO Patent Application WO/2024/034789
Kind Code:
A1
Abstract:
Solder particles having an active coating formed thereon according to the present invention comprise: a low-melting-point solder particle including tin and bismuth; and an active coating which is formed by pressing an active agent on the surface of the solder particle.
More Like This:
| WO/2001/081037 | AID FOR WELDING OR CUTTING |
Inventors:
KIM JUNG HO (KR)
Application Number:
PCT/KR2023/006809
Publication Date:
February 15, 2024
Filing Date:
May 19, 2023
Export Citation:
Assignee:
O COMPANY CO LTD (KR)
International Classes:
B23K35/02; B23K35/22; C08J5/18; C08K3/08; C08K9/00; C08L63/00; H01B1/22; H01B5/16; H01R11/01
Foreign References:
| JP2000317682A | 2000-11-21 | |||
| KR20030035257A | 2003-05-09 | |||
| KR100977163B1 | 2010-08-20 | |||
| KR20060026020A | 2006-03-22 | |||
| JP2006255762A | 2006-09-28 |
Attorney, Agent or Firm:
ECM IP & LAW FIRM (KR)
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