Title:
METHOD OF FORMING COMPONENT AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/221023
Kind Code:
A1
Abstract:
A method of forming a component used in a plasma processing device. The method of forming a component comprises a step of, while supplying a raw material of the component in accordance with a surface state of the component, irradiating the raw material with an energy beam.
Inventors:
SAITO MICHISHIGE (JP)
NAGASEKI KAZUYA (JP)
KANEKO SHOTA (JP)
NAGASEKI KAZUYA (JP)
KANEKO SHOTA (JP)
Application Number:
PCT/JP2019/018735
Publication Date:
November 21, 2019
Filing Date:
May 10, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; C23C16/44; H05H1/46
Domestic Patent References:
| WO2016178777A1 | 2016-11-10 |
Foreign References:
| JP2018507327A | 2018-03-15 | |||
| JP2015506855A | 2015-03-05 | |||
| JP2017060735A | 2017-03-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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