Title:
METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE FILM WITH CONTROLLED FLUIDITY OF CONDUCTIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/068559
Kind Code:
A1
Abstract:
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compression process by fixing the conductive particles with strong force through the high modulus of a polymer. In particular, a non-flowable conductive layer including conductive particles is formed through a semi-curing process to fix the conductive particles with the modulus force of a polymer resin, and thus, when resin flow is generated by pressure in a compression process, the movement of the conductive particles is minimized. In addition, an adhesive layer is formed on the upper and lower portions of a semi-cured polymer film layer to optimize the physical properties of the anisotropic conductive adhesive film by improving physical properties that are deteriorated by the semi-cured film, such as adhesive strength, reliability, and connection resistance.
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Inventors:
KIM DONG WON (KR)
LEE KYU MAHN (KR)
KIM DONG SEOK (KR)
KO BYUNG UG (KR)
LEE KYU MAHN (KR)
KIM DONG SEOK (KR)
KO BYUNG UG (KR)
Application Number:
PCT/KR2022/013649
Publication Date:
April 27, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
H＆S HIGHTECH CORP (KR)
International Classes:
C09J9/02; C09J7/20; C09J7/38; C09J11/04; C09J163/00
Foreign References:
| KR20060123491A | 2006-12-01 | |||
| KR20180020520A | 2018-02-28 | |||
| KR20160117455A | 2016-10-10 | |||
| KR20160012532A | 2016-02-03 | |||
| KR20200087029A | 2020-07-20 |
Attorney, Agent or Firm:
JUNG, Seung Hun (KR)
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