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Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND ADHESIVE SHEET USED IN METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/011850
Kind Code:
A1
Abstract:
Provided is a simplified method for manufacturing a chip-like electronic component such as a semiconductor chip. This manufacturing method comprises: a step wherein an adhesive sheet, which has a base, a thermally expandable adhesive layer that is provided on one surface of the base and contains thermally expandable micropellets, and a dielectric layer that is provided on the other surface of the base and comprises a slightly adhesive layer and an adhesive layer sequentially from the base side, is bonded to a substrate such that the thermally expandable adhesive layer is on the substrate side; a step wherein a plurality of chip-like electronic components are bonded and affixed to the adhesive layer-side surface of the adhesive sheet such that the electrode surfaces of the electronic components are on the adhesive layer side; a step wherein the entire surfaces of the plurality of chip-like electronic components excluding the affixing surfaces are covered with a protective material, thereby obtaining a sealed molded body that contains the plurality of chip-like electronic components; a step wherein the adhesive sheet is heated so that the thermally expandable micropellets in the thermally expandable adhesive layer are expanded, thereby lowering the adhesive power of the thermally expandable micropellets and separating the thermally expandable adhesive layer from the substrate; a step wherein the slightly adhesive layer is separated from the adhesive layer, thereby obtaining a laminate of the adhesive layer and the sealed molded body; and a step wherein the laminate is cut between the plurality of chip-like electronic components, thereby being divided into separate chip-like electronic components.

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Inventors:
HIRAYAMA TAKAMASA (JP)
SHIMOKAWA DAISUKE (JP)
Application Number:
PCT/JP2012/067360
Publication Date:
January 24, 2013
Filing Date:
July 06, 2012
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
HIRAYAMA TAKAMASA (JP)
SHIMOKAWA DAISUKE (JP)
International Classes:
C09J7/38; H01L21/56; C09J11/00; C09J201/00; H01L21/301; H01L23/29; H01L23/31
Domestic Patent References:
WO2011074520A12011-06-23
Foreign References:
JP2011129649A2011-06-30
JP2006049482A2006-02-16
JP2010039472A2010-02-18
JPH0940931A1997-02-10
JP2001308116A2001-11-02
JP2011009709A2011-01-13
JP2001308116A2001-11-02
JPS5661468A1981-05-26
JPS61174857A1986-08-06
JPS6317981A1988-01-25
JPS5613040A1981-02-07
JPS60196956A1985-10-05
Attorney, Agent or Firm:
MOMII, Takafumi (JP)
Takafumi Momii (JP)
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Claims:



 
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