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Title:
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/148004
Kind Code:
A1
Abstract:
According to the present invention, a light emitting device is manufactured by bonding an LED element 52 on a wiring substrate 51 with an anisotropic conductive adhesive 50 being interposed therebetween. During the production of this device, the anisotropic conductive adhesive 50 is arranged on the wiring substrate 51, and the LED element 52 is arranged on the anisotropic conductive adhesive 50. The anisotropic conductive adhesive 50 is configured to contain a polymerizable epoxy-modified silicone resin and a metal chelate compound. When the LED element 52 is pressed by means of a pressure application body 53, the wiring substrate 51 is maintained at a temperature of from 160°C to 210°C (inclusive), while maintaining the pressure application body 53 at a temperature lower than the temperature of the wiring substrate 51, and the LED element 52 is pressed for a predetermined pressing period of time. Since the epoxy-modified silicone resin and the metal chelate compound react with each other at a low temperature, the LED element 52 is able to be temporarily connected to the wiring substrate 51 without collapsing a phosphor layer.

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Inventors:
UMETSU NORIO (JP)
Application Number:
PCT/JP2016/057527
Publication Date:
September 22, 2016
Filing Date:
March 10, 2016
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L33/62; C09J5/06; C09J9/02; C09J11/06; C09J183/04
Domestic Patent References:
WO2014132979A12014-09-04
Foreign References:
JP2011137117A2011-07-14
JP2011222830A2011-11-04
JP2014159499A2014-09-04
JP2014067507A2014-04-17
JP2013179215A2013-09-09
Other References:
See also references of EP 3273493A4
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)
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