Title:
METHOD FOR MANUFACTURING RESIN STRUCTURE, AND RESIN STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/016989
Kind Code:
A1
Abstract:
This method for manufacturing a resin structure (1) is provided with: a step for arranging a sheet having a smooth surface (31) having a maximum height roughness of 3 μm or less, inside a forming mold (40) such that the smooth surface (31) faces an internal space (44) of the forming mold (40); a step for molding a resin molded body (10) to which the sheet (30) is adhered, by filling the internal space (44) with a resin; a step for separating the resin molded body (10) from the sheet (30), thereby forming a first region (11) having a maximum height roughness of 3 μm or less on at least a portion of the surface of the resin molded body (10); and a step for using a fluid conductive ink to form a wiring (20) on the first region (11).
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Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2018/005488
Publication Date:
January 24, 2019
Filing Date:
February 16, 2018
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H05K3/38; B29C33/68; B29C45/14; H05K3/00; H05K3/10; H05K3/22
Domestic Patent References:
| WO2014073417A1 | 2014-05-15 |
Foreign References:
| JP2010272756A | 2010-12-02 | |||
| JP2017034150A | 2017-02-09 | |||
| JP2004006829A | 2004-01-08 | |||
| JP2006229115A | 2006-08-31 | |||
| JPH11312849A | 1999-11-09 | |||
| JP2012136769A | 2012-07-19 | |||
| JP2001196705A | 2001-07-19 | |||
| JP2010272756A | 2010-12-02 | |||
| JP2014073417A | 2014-04-24 | |||
| JP2014077081A | 2014-05-01 |
Other References:
See also references of EP 3657918A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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