Title:
METHOD FOR PRODUCING MOLD BY DRY ETCHING PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/073729
Kind Code:
A1
Abstract:
The present invention provides a novel method for producing a mold, which is capable of forming a fine recessed and projected structure on the surface of a mold by a reactive ion etching process without essentially requiring patterning and the like. A method for producing a mold that has a recessed and projected structure on the surface according to the present invention is characterized by comprising an etching step wherein a plasma is generated in the presence of a mixed gas and reactive ion etching is performed on the surface of a substrate and by not comprising a patterning step wherein the surface of the substrate is subjected to patterning before the etching step. This method is also characterized in that: the mixed gas contains two kinds of fluorine-based gases; one of the two kinds of fluorine-based gases is a sulfur hexafluoride gas (SF6); and the other of the two kinds of fluorine-based gases is a fluorine-based gas other than a sulfur hexafluoride gas.
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Inventors:
KAWASHIMA HIROSHI (JP)
Application Number:
PCT/JP2018/033362
Publication Date:
April 18, 2019
Filing Date:
September 10, 2018
Export Citation:
Assignee:
ENPLAS CORP (JP)
International Classes:
B29C59/16; B29C33/38; H01L21/3065
Domestic Patent References:
| WO2017037918A1 | 2017-03-09 |
Foreign References:
| JP2015182465A | 2015-10-22 | |||
| JP2009212289A | 2009-09-17 | |||
| JP2000174004A | 2000-06-23 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
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