Title:
METHOD FOR REMOVING ATTACHMENT ADHESIVE, STRUCTURE, AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/024668
Kind Code:
A1
Abstract:
Provided is a method for using an aqueous liquid such as water to remove, with little load on the adherend, by using a remover tape, an adhesive that has remained on the surface of a member or article. Provided is a method for removing, from the surface of a member or article, an attachment adhesive partially present on the surface. This method comprises: a step for applying, to the surface of the member or article so as to be overlaid over the attachment adhesive, an adhesive surface of remover tape that has a pressure-sensitive adhesive layer; and a step for peeling the remover tape off of the surface of the member or article. The peeling step is implemented in a state in which there is an aqueous liquid present at the place where the pressure-sensitive adhesive layer is to be peeled from the surface.
Inventors:
TOBINAGA SHUN (JP)
KOSAKA NAOFUMI (JP)
SHIMIZU YOSUKE (JP)
KOSAKA NAOFUMI (JP)
SHIMIZU YOSUKE (JP)
Application Number:
PCT/JP2021/025128
Publication Date:
February 03, 2022
Filing Date:
July 02, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; C09J5/00; C09J7/10; C09J7/38; C09J11/04; C09J11/08; C09J201/00
Domestic Patent References:
| WO2010026938A1 | 2010-03-11 |
Foreign References:
| JP2020023679A | 2020-02-13 | |||
| JP2020023656A | 2020-02-13 | |||
| JP2016108468A | 2016-06-20 | |||
| JP2016047904A | 2016-04-07 | |||
| JP2001348541A | 2001-12-18 | |||
| JPH0888206A | 1996-04-02 | |||
| JP2021095450A | 2021-06-24 | |||
| JP2021024182A | 2021-02-22 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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