Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/131774
Kind Code:
A1
Abstract:
A module (101) comprising a main substrate (1) having a first surface (1a); a sub-module (81) mounted on the first surface (1a); a first component (31) mounted on the first surface (1a), separately from the sub-module (81); and a first sealing resin (6a) formed so as to cover the first surface (1a), the sub-module (81), and the first component (31). The sub-module (81) comprises: a second component (32); a second sealing resin (6c) disposed so as to cover the second component (32); and an internal shielding film (9) formed so as to cover part of a surface on the far side of the second sealing resin (6c) at least from the first surface (1a). The surface on the far side of the sub-module (81) from the first surface (1a) includes a striped section formed as a result of having alternately disposed therein an area covered by the internal shielding film (9) and an area in which the second sealing resin (6c) is exposed.
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Inventors:
OTSUBO YOSHIHITO (JP)
KUSUYAMA TAKAFUMI (JP)
KUSUYAMA TAKAFUMI (JP)
Application Number:
PCT/JP2020/046232
Publication Date:
July 01, 2021
Filing Date:
December 11, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/04; H01L23/00; H01L23/28; H01L25/10; H01L25/18; H05K1/02; H05K1/18; H05K3/28; H05K9/00
Domestic Patent References:
| WO2019098316A1 | 2019-05-23 | |||
| WO2008136251A1 | 2008-11-13 | |||
| WO2018101384A1 | 2018-06-07 | |||
| WO2019138895A1 | 2019-07-18 | |||
| WO2018164158A1 | 2018-09-13 | |||
| WO2018159482A1 | 2018-09-07 | |||
| WO2021006141A1 | 2021-01-14 |
Foreign References:
| JP2012009745A | 2012-01-12 | |||
| US20180158779A1 | 2018-06-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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