Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/140850
Kind Code:
A1
Abstract:
This module (101) comprises: a substrate (1) having a first surface (1a); at least one first component mounted on the first surface (1a); a shield member (8) mounted on the first surface (1a) to cover the first component; and a first sealing resin (6a) arranged at least between the shield member (8) and the first surface (1a), the shield member (8) having a plate-shaped top surface part (81), and a plurality of leg parts (82) extending facing the first surface (1a) from the top surface part (81).
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Inventors:
NOMURA TADASHI (JP)
YAMAGUCHI YUKIYA (JP)
NISHIKAWA HIROSHI (JP)
KOMATSU TORU (JP)
YAMAGUCHI YUKIYA (JP)
NISHIKAWA HIROSHI (JP)
KOMATSU TORU (JP)
Application Number:
PCT/JP2020/046747
Publication Date:
July 15, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/00; H01L25/04; H01L25/18; H05K9/00
Domestic Patent References:
| WO2019138895A1 | 2019-07-18 | |||
| WO2018181708A1 | 2018-10-04 |
Foreign References:
| JP2015211105A | 2015-11-24 | |||
| JP2008084964A | 2008-04-10 | |||
| JP2016192445A | 2016-11-10 | |||
| JP2004260103A | 2004-09-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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