Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2023/074795
Kind Code:
A1
Abstract:
This module (100) comprises a substrate (110), a first component (120), and a sealing resin (150). The substrate (110) has a first surface (111). The first component (120) is mounted on the first surface (111). The sealing resin (150) seals the first component (120) at least from the side. The first component (120) has a protruding part (121). The protruding part (121) protrudes from the sealing resin (150) on the side opposite to the substrate (110) side.
Inventors:
KATSUBE AKIO (JP)
SHINKAI HIDEKI (JP)
SHINKAI HIDEKI (JP)
Application Number:
PCT/JP2022/040142
Publication Date:
May 04, 2023
Filing Date:
October 27, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L23/00; H01L23/28; H01L25/00
Domestic Patent References:
| WO2007114224A1 | 2007-10-11 | |||
| WO2021215108A1 | 2021-10-28 | |||
| WO2017033575A1 | 2017-03-02 | |||
| WO2015098792A1 | 2015-07-02 |
Foreign References:
| JP2006197170A | 2006-07-27 | |||
| JP2014116368A | 2014-06-26 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: