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Patent Searching and Data


Title:
MOLDED FOAM ARTICLE, FOAM SOLE, AND SHOES
Document Type and Number:
WIPO Patent Application WO/2013/179455
Kind Code:
A1
Abstract:
Provided is a molded foam article which includes a foam obtained by foaming a formation material comprising a resin component, the Asker C hardness of the foam being 10 or higher and the ratio (E40/E0) of the modulus of elasticity (E40) at 40% strain in relation to the modulus of elasticity (E0) at 0% strain for the foam being 0.5 or higher. This molded foam article is suitably soft and has little change in hardness under compressive deformation.

Inventors:
TATEISHI JUNICHIRO (JP)
HARANO KENICHI (JP)
YAMADA KEISUKE (JP)
NASAKO MITSUO (JP)
Application Number:
PCT/JP2012/064153
Publication Date:
December 05, 2013
Filing Date:
May 31, 2012
Export Citation:
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Assignee:
ASICS CORP (JP)
TATEISHI JUNICHIRO (JP)
HARANO KENICHI (JP)
YAMADA KEISUKE (JP)
NASAKO MITSUO (JP)
International Classes:
C08J9/06
Domestic Patent References:
WO2009028564A12009-03-05
WO2004090028A12004-10-21
WO2008013060A12008-01-31
WO2008152935A12008-12-18
Foreign References:
JP2012504694A2012-02-23
JP2009056007A2009-03-19
JP2005205204A2005-08-04
JP2011111566A2011-06-09
JPH10217270A1998-08-18
JP3167047U2011-03-31
JP2008308619A2008-12-25
Other References:
See also references of EP 2857444A4
Attorney, Agent or Firm:
OUCHI Nobuo et al. (JP)
Nobuo Ouchi (JP)
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