Title:
MOLDING MATERIAL, ACOUSTIC MATCHING MEMBER, AND ULTRASONIC SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/112439
Kind Code:
A1
Abstract:
Provided are: a molding material from which acoustic matching layers having sufficient acoustic properties can be produced and which has satisfactory moldability; a molded article and an acoustic matching member which are obtained using the molding material; and an ultrasonic sensor including the acoustic matching member as an acoustic matching layer. The molding material comprises (A) one or more heat-curable resins, (B) a reactive diluent, (C) a thermoplastic resin, (D) hollow inorganic particles, and (E) a thermopolymerization initiator, wherein the heat-curable resins (A) comprise (a-1) at least one resin selected from the group consisting of unsaturated polyester resins having a content of ethylenically unsaturated groups of 0.1-2.0 mol/kg and vinyl ester resins having a content of ethylenically unsaturated groups of 0.1-2.0 mol/kg and the heat-curable resins (A) as a whole have a content of ethylenically unsaturated groups of 0.5-3.5 mol/kg.
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Inventors:
ISHIUCHI RYUJIN (JP)
MIKI TOSHITADA (JP)
MORI MASATOSHI (JP)
MIKI TOSHITADA (JP)
MORI MASATOSHI (JP)
Application Number:
PCT/JP2022/037277
Publication Date:
June 22, 2023
Filing Date:
October 05, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08F283/01; C08F290/06; C08K7/24; C08L51/08
Domestic Patent References:
| WO2021220934A1 | 2021-11-04 | |||
| WO2005097895A1 | 2005-10-20 |
Foreign References:
| JP2015150221A | 2015-08-24 | |||
| JP2000309697A | 2000-11-07 | |||
| JPH0995519A | 1997-04-08 | |||
| JPS63103994A | 1988-05-09 | |||
| JP2008172306A | 2008-07-24 | |||
| JP2009005383A | 2009-01-08 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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