MULTI-CHANNEL SOLDER BALL PLACEMENT INJECTOR

WIPO Patent Application WO/2023/092471

A1

Disclosed is a multi-channel solder ball placement injector, comprising an injector body. A plurality of longitudinal dropping channels and a plurality of feeding channels having one-to-one correspondence to and communicated with the longitudinal dropping channels are separately formed inside the injector body, and a loading channel communicated with the feeding channels is formed on the injector body; a dropping control mechanism is arranged on the injector body, and the dropping control mechanism is arranged corresponding to a position where the longitudinal dropping channels are communicated with the feeding channels. According to the multi-channel solder ball placement injector, a plurality of solder balls can be injected out at the same time for ball placement, so that the ball placement efficiency is effectively improved, the solder balls can be controlled to move quickly in the injector body and be injected out one by one from a nozzle, the solder balls can be accurately placed onto the surface of a circuit board, a wafer, or a chip, the ball placement efficiency, the yield, and the precision are high, the injector is suitable for ball placement of elements having various shapes and models, the structure is simple, the overall size is small, the machining cost is low, and the operation stability is good.

LUO HOUYONG (CN)
WU PENG (CN)

PCT/CN2021/133585

June 01, 2023

November 26, 2021

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DONGGUAN D TEK TECH CO LTD (CN)

B23K3/06; B23K101/36

CN213857521U	2021-08-03
CN103427309A	2013-12-04
CN203459791U	2014-03-05
CN213857522U	2021-08-03
CN105108264A	2015-12-02
CN214350137U	2021-10-08
JP2002093844A	2002-03-29

BEIJING XINGZHI XIANGDA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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