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Patent Searching and Data


Title:
SINGLE-HEAD SOLDER BALL PLACEMENT JET NOZZLE
Document Type and Number:
WIPO Patent Application WO/2023/092470
Kind Code:
A1
Abstract:
Disclosed in the present invention is a single-head solder ball placement jet nozzle, comprising a jet nozzle body, wherein the jet nozzle body is internally provided with a longitudinal material falling channel and a material feeding channel in communication with the longitudinal material falling channel; a material loading channel in communication with the material feeding channel is further provided on the jet nozzle body; and a material falling control mechanism is provided on the jet nozzle body, and the material falling control mechanism corresponds to a position where the material feeding channel communicates with the longitudinal material falling channel. By means of the single-head solder ball placement jet nozzle, solder balls can be controlled to move rapidly in the jet nozzle body and are jetted out from the nozzle one by one in an ordered manner, and the solder balls can be accurately placed onto a surface of a circuit board, a wafer or a chip; the solder balls with particle sizes of 0.06 mm or above can be accurately controlled for placement; the ball placement efficiency, the yield, and the accuracy are high; and the ball placement jet nozzle is suitable for ball placement for elements of various shapes, models and sizes, the processing cost is low, and the operation stability is good.

Inventors:
LUO HOUYONG (CN)
WU PENG (CN)
Application Number:
PCT/CN2021/133584
Publication Date:
June 01, 2023
Filing Date:
November 26, 2021
Export Citation:
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Assignee:
DONGGUAN D TEK TECH CO LTD (CN)
International Classes:
B23K3/06
Foreign References:
CN213857521U2021-08-03
CN112388098A2021-02-23
CN213857522U2021-08-03
JP2008264844A2008-11-06
CN210587559U2020-05-22
CN105108264A2015-12-02
CN110640251A2020-01-03
CN106695055A2017-05-24
Attorney, Agent or Firm:
BEIJING XINGZHI XIANGDA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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