Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND POLYIMIDE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2018/003726
Kind Code:
A1
Abstract:
Provided is a negative photosensitive resin composition with which it is possible to produce a film having a high glass transition temperature, and a high residual film thickness of the exposed part when developed. Also provided are a cured film using the negative photosensitive resin composition, a method for producing the cured film, a semiconductor device, a method for producing a laminate, a method for producing a semiconductor device, and a polyimide precursor. The negative photosensitive composition contains a polyimide precursor, a photopolymerization initiator, and a solvent. The polyimide precursor has a repeating unit represented by formula (1), and a structure represented by "(A)l-L1-*" on at least one terminal. In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, R1 is a polymerizable group, and R2 is a monovalent organic group. In the abovementioned structure, A represents a polymerizable group, L1 represents a single bond or an l+1-valent organic group, l represents an integer from 2 to 10, and * represents the binding site with another site.
Inventors:
YOSHIDA KENTA (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
Application Number:
PCT/JP2017/023342
Publication Date:
January 04, 2018
Filing Date:
June 26, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; C08F2/48; C08G73/10; G03F7/031; G03F7/20; G03F7/40
Domestic Patent References:
| WO2015199219A1 | 2015-12-30 |
Foreign References:
| JP2015219491A | 2015-12-07 | |||
| JP2015151405A | 2015-08-24 | |||
| JP2016027357A | 2016-02-18 | |||
| JPH07133428A | 1995-05-23 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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