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Title:
OPTICAL PATH CONVERSION COMPONENT-EQUIPPED CIRCUIT BOARD AND WIRING MODULE TO BE MOUNTED ON CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/210529
Kind Code:
A1
Abstract:
An optical path conversion component-equipped circuit board (1A) is provided with a circuit board (20) having a principal surface (21), an optical path conversion component (11) connected to the circuit board (20), and one or more first tape fibers (12). The one or more first tape fibers (12) each have a first end (12a) and a second end (12b), and include a plurality of optical fibers (13) optically coupled to the optical path conversion component (11) at the first end (12a). The one or more first tape fibers (12) are each provided to extend in a direction (D3) crossing the normal line of the principal surface (21). The optical path conversion component (11) has at least one channel group (113) comprising a plurality of channels (112) optically coupled to the plurality of optical fibers (13), respectively, with respect to each of the one or more first tape fibers (12). The plurality of channels (112) are arranged along a direction (D1) crossing the main surface (21) in each of the at least one channel group (113).

Inventors:
NGUYEN HONG CHUYEN (JP)
NAKANISHI TETSUYA (JP)
KUMAGAI TSUTARU (JP)
Application Number:
PCT/JP2021/015156
Publication Date:
October 21, 2021
Filing Date:
April 12, 2021
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
G02B6/42
Domestic Patent References:
WO2018198490A12018-11-01
Foreign References:
JP2017134282A2017-08-03
JP2000101103A2000-04-07
US20190317288A12019-10-17
JP2018081204A2018-05-24
JP2018081120A2018-05-24
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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