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Patent Searching and Data


Title:
PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/196097
Kind Code:
A1
Abstract:
In the present invention, a frame body (120) is made of a ceramic and has a first surface (SF1) and a second surface (SF2). The second surface (SF2) has an inner edge surrounding a cavity (CV) and an outer edge (EO) surrounding the inner edge. A substrate part (110) is made of a ceramic and has a third surface (SF3) having a portion supporting the second surface (SF2) of the frame part (120), and a portion facing the cavity (CV). An electrode layer (200) is provided on the third surface (SF3) of the substrate part (110). A via electrode (510) has an end surface (SFA) having a diameter DA on the first surface (SF1), and a bottom surface (SFB) that has a diameter DB smaller than the diameter DA and that is in contact with the electrode layer (200) on the second surface (SF2). The bottom surface (SFB) of the via electrode, in a plan view, has a minimum dimension LI from the inner edge of the second surface (SF2) of the frame part (120), and a minimum dimension LO from the outer edge (EO) of the second surface (SF2) of the frame part (120), and LO>LI is satisfied.

Inventors:
OGATA TAKATOMO (JP)
SAKA TAKANOBU (JP)
Application Number:
PCT/JP2022/002211
Publication Date:
September 22, 2022
Filing Date:
January 21, 2022
Export Citation:
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Assignee:
NGK ELECTRONICS DEVICES INC (JP)
NGK INSULATORS LTD (JP)
International Classes:
H01L23/04; H01L23/08
Domestic Patent References:
WO2020208999A12020-10-15
Foreign References:
JP2002064354A2002-02-28
JP2013004693A2013-01-07
JP2003218660A2003-07-31
JP2019192825A2019-10-31
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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