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Title:
PHOTOCURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/120495
Kind Code:
A1
Abstract:
The present invention provides: a photocurable silicone resin composition that has excellent adhesiveness with respect to a cyclic olefin resin film and a molded body, and which can provide excellent pencil hardness; a cured film; and a laminate thereof. Provided is a photocurable silicone resin composition to be used as a hard coat layer of a cyclic olefin resin film, said photocurable silicone resin composition being characterized by comprising: 100 parts by mass of a silicone resin composition (A) containing, at a mass ratio of 1:99-99:1, a reactive silicone resin (A1) that contains, as the main component, a polyorganosilsesquioxane which has a cage structure in the structural unit thereof and is represented by general formula (1) [RSiO3/2]n (1) (where R is an organic functional group having a (meth)acryloyl group, and n is 8, 10, or 12), and an unsaturated compound (A2) that contains in one molecule thereof at least one unsaturated group which is represented by -R3-CR4=CH2 or -CR4=CH2 (where R3 represents an alkylene group, an alkylidene group, or a -O-C(=O)- group, and R4 represents a hydrogen atom or an alkyl group) and that is capable of radical copolymerization with the silicone resin (A1); and 0.1-20 parts by mass of a photopolymerization initiator (B), wherein the number of moles of acrylic in 100 g of the silicone resin composition (A) is 0.8-1.1, not less than 20 mass% of the silicone resin composition (A) is an unsaturated compound containing a hydroxyl group, and a benzophenone-based photopolymerization initiator is used as the photopolymerization initiator (B).

Inventors:
KAWATANI TOSHIHIRO (JP)
SAITO TAKASHI (JP)
Application Number:
PCT/JP2022/046749
Publication Date:
June 29, 2023
Filing Date:
December 19, 2022
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C09D4/02; C08F2/50; C08F220/28; C09D7/63; C09D183/04
Domestic Patent References:
WO2006035646A12006-04-06
WO2020162615A12020-08-13
Foreign References:
JP2010073495A2010-04-02
JP2009221321A2009-10-01
JP6530027B22019-06-12
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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