PHOTOSENSITIVE COMPOSITION, SHEET FOR PHOTOSENSITIVE RESIST, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIPO Patent Application WO/2007/135894

A1

Disclosed is a photosensitive composition containing a addition-polymerizable, ethylenic double bond-containing compound (A), a photopolymerization initiator (B), a sensitizing dye (C) and a polymer binder (D). This photosensitive composition is characterized in that a reaction product of bisphenol A and an ester of a polyalkylene oxide and a (meth)acrylic acid is contained as the addition-polymerizable, ethylenic double bond-containing compound (A), and a compound represented by the general formula (1) below is contained as the sensitizing dye (C). Also disclosed are a photosensitive resist sheet using the photosensitive composition, which has high sensitivity and excellent resolution, a method for forming a resist pattern using the photosensitive composition, and a method for manufacturing a printed wiring board. [chemical formula 1] (1)

JPH04248814	PHOTOINITIATOR FOR STARTING CURING, CURABLE COMPOSITION AND FORMATION OF CURED POLYMERIC SEALANT
WO/2001/095033	PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE MATERIAL USING THE SAME
JPH08278631	PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE PLANOGRAPHIC PRINTING PLATE AND METHOD FOR DEVELOPING FOR THEM

TAKAMUKI YASUHIKO (JP)

PCT/JP2007/059935

November 29, 2007

May 15, 2007

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KONICA MINOLTA MED & GRAPHIC (JP)
TAKAMUKI YASUHIKO (JP)

G03F7/031; C09B57/00; G03F7/004; G03F7/027; G03F7/40; H05K3/00; H05K3/06; H05K3/18

WO2000074930A2

2000-12-14

JP2002287380A	2002-10-03
JP2006106283A	2006-04-20

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