Title:
PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/016480
Kind Code:
A1
Abstract:
This photosensitive conductive paste is characterized by containing a metal powder, a metal resinate which contains a metal having a melting point higher than the melting point of the metal powder, and a photosensitive organic component. This photosensitive conductive paste is also characterized in that: the content of the metal resinate relative to the metal powder is from 0.0025% by weight to 1.0% by weight (inclusive) in terms of metals; and the content of the metal powder in the photosensitive conductive paste is from 68% by weight to 88% by weight (inclusive).
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Inventors:
KONDO KENTA (JP)
Application Number:
PCT/JP2017/025940
Publication Date:
January 25, 2018
Filing Date:
July 18, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G03F7/004; H01B1/22; H01F17/00; H01F41/04; H05K3/12
Domestic Patent References:
| WO2016076024A1 | 2016-05-19 |
Foreign References:
| JP2014142587A | 2014-08-07 | |||
| JP2011118191A | 2011-06-16 | |||
| JP2013222031A | 2013-10-28 | |||
| JP2007194580A | 2007-08-02 | |||
| JP2004047856A | 2004-02-12 | |||
| JP2000331535A | 2000-11-30 | |||
| JP2000305259A | 2000-11-02 | |||
| JPS4916894A | 1974-02-14 | |||
| JPS5727506A | 1982-02-13 | |||
| JP2014187255A | 2014-10-02 | |||
| JP2005197021A | 2005-07-21 | |||
| JPH01107592A | 1989-04-25 | |||
| US3877950A | 1975-04-15 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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