PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIPO Patent Application WO/2002/025377

A1

A photosensitive element having a support film and a photosensitive resin layer formed on the support film. The support film is a multilayer support film composed of at least three layers. The photosensitive resin layer is made of a photosensitive resin composition containing (A) a binder polymer, (B) photopolymerizable compound having at least one polymerizable ethylenic unsaturated group in a molecule, and (C) a photopolymerization initiator. A method for forming a resist pattern characterized in that such a photosensitive element is so placed on a circuit-forming board that the photosensitive resin layer is in contact with the circuit-forming board, an exposure area is formed by irradiating a predetermined portion of the photosensitive resin layer with activating light, and the portion other than the exposure area is removed and a method for manufacturing a printed wiring board characterized in that a circuit-forming board on which a resist pattern is formed by such a resist pattern forming method is etched or plated are also disclosed.

AOKI TOMOAKI (JP)
KAWAGUCHI TAKU (JP)
ICHIKAWA TATSUYA (JP)

PCT/JP2001/008192

March 28, 2002

September 20, 2001

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HITACHI CHEMICAL CO LTD (JP)
AOKI TOMOAKI (JP)
KAWAGUCHI TAKU (JP)
ICHIKAWA TATSUYA (JP)

B32B27/06; B32B27/08; G03F7/028; G03F7/09; G03F7/027; (IPC1-7): G03F7/004; G03F7/028; G03F7/09; B32B27/36

JP2000214583A	2000-08-04
JPH09211851A	1997-08-15
JPH06287288A	1994-10-11
JPH04248843A	1992-09-04
JP2001005178A	2001-01-12

Hasegawa, Yoshiki (Okura-honkan 6-12 Ginza 2-chome Chuo-ku, Tokyo, JP)

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