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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2015/098870
Kind Code:
A1
Abstract:
This photosensitive resin composition contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from (meth)acrylic acid, a structural unit derived from styrene or α-methylstyrene, and a structural unit derived from a hydroxyalkyl ester of (meth)acrylic acid that has a C1 - 12 hydroxyalkyl group. The photopolymerizable compound contains a bisphenol di(meth)acrylate that contains 1 to 20 ethyleneoxy structural units and 0 to 7 propyleneoxy structural units.

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Inventors:
OKADE SHOTA (JP)
MIYASAKA MASAHIRO (JP)
MURAMATSU YUKIKO (JP)
Application Number:
PCT/JP2014/083965
Publication Date:
July 02, 2015
Filing Date:
December 22, 2014
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/033; G03F7/004; G03F7/027
Domestic Patent References:
WO2006035807A12006-04-06
Foreign References:
JP2012198573A2012-10-18
JP2006293094A2006-10-26
JP2008152285A2008-07-03
JP2013246387A2013-12-09
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (JP)
Patent business corporation solar international patent firm (JP)
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