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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE TRANSFER MATERIAL, METHOD FOR PRODUCING CIRCUIT WIRING, AND METHOD FOR PRODUCING TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2019/022089
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition comprising: a polymer containing a constituent unit having a group in which a carboxylic acid group is protected in the form of acetal; a photo-acid-generating agent that is at least one selected from the group consisting of an oxime compound and an onium salt compound; and a latent pigment having a wavelength range at the time of color development of 400 to 780 nm, and a maximum absorption wavelength of at least 500 nm. Also provided are: a photosensitive transfer material including said photosensitive resin composition; a method for producing a circuit wiring using said photosensitive transfer material; and a method for producing a touch panel.

Inventors:
GOTO HIDENORI (JP)
YAMADA SATORU (JP)
Application Number:
PCT/JP2018/027762
Publication Date:
January 31, 2019
Filing Date:
July 24, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F20/28; G03F7/039; G06F3/041
Foreign References:
JP2002091004A2002-03-27
JP2002214771A2002-07-31
JP2004326094A2004-11-18
JP2006220863A2006-08-24
JP2006292957A2006-10-26
JP2004361557A2004-12-24
JP2008122501A2008-05-29
JP2010237310A2010-10-21
JP2000284473A2000-10-13
JP2002240441A2002-08-28
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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