Title:
PHOTOSENSITIVE TRANSFER MATERIAL, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING RESIN PATTERN, AND METHOD FOR PRODUCING CIRCUIT WIRING LINE
Document Type and Number:
WIPO Patent Application WO/2019/146380
Kind Code:
A1
Abstract:
The present disclosure provides a photosensitive transfer material which sequentially comprises, on a cover film, a photosensitive layer, an intermediate layer, an adhesive layer and a provisional supporting body in this order, and which is configured such that: the intermediate layer contains particles; the intermediate layer and the adhesive layer are in contact with each other; the intermediate layer and the adhesive layer are able to be separated from each other; and the surface of the intermediate layer after the separation of the intermediate layer and the adhesive layer from each other has recesses and projections, which are formed by the particles. The present disclosure also provides: a method for producing this photosensitive transfer material; and a method for producing a resin pattern and a method for producing a circuit wiring line, each of which uses this photosensitive transfer material.
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Inventors:
FUJIMOTO SHINJI (JP)
KANNA SHINICHI (JP)
MOROZUMI KAZUMASA (JP)
SASATA KATSUMI (JP)
KANNA SHINICHI (JP)
MOROZUMI KAZUMASA (JP)
SASATA KATSUMI (JP)
Application Number:
PCT/JP2018/048463
Publication Date:
August 01, 2019
Filing Date:
December 28, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F2/44; G03F7/033; G03F7/039; G03F7/11; G03F7/20; H05K3/06
Domestic Patent References:
| WO2016132401A1 | 2016-08-25 |
Foreign References:
| JP2006243272A | 2006-09-14 | |||
| JP2003215794A | 2003-07-30 | |||
| JP2002341525A | 2002-11-27 | |||
| JP2004086089A | 2004-03-18 | |||
| JP2011522284A | 2011-07-28 | |||
| US20170255100A1 | 2017-09-07 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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