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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/047714
Kind Code:
A1
Abstract:
[Problem] The purpose of this invention is to provide a polishing composition that can sufficiently control the polishing rate of a material containing Si. [Solution] Provided is a polishing composition that contains a pH adjusting agent and an organic compound, the organic compound being represented by formula (1), provided that A is an electron-withdrawing group. The pH of the polishing composition is over 7.5.

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WO/2011/030706DISPERSANT FOR SILICA PARTICLES OR CERIA PARTICLES, AND ABRASIVE
JP2004092904FRICTION MATERIAL HAVING FRICTION MODIFYING LAYER
JP2022039461COMPOSITION FOR POLISHING AND CONCENTRATED LIQUID OF THE SAME, AND POLISHING METHOD USING THE SAME
Inventors:
SUZUKI SHOTA (JP)
Application Number:
PCT/JP2015/076987
Publication Date:
March 31, 2016
Filing Date:
September 24, 2015
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C01G1/02; H01L21/304
Foreign References:
US20050090109A12005-04-28
JP2001342454A2001-12-14
JPH1012584A1998-01-16
JP2000299320A2000-10-24
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
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