Title:
POLISHING DEVICE, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/228579
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which machinability in a short time period is improved. As a means for overcoming the problem, a polishing device (10) for polishing a workpiece (10) is required to have a configuration provided with a cavitation generating ejection device (50), wherein: the cavitation generating ejection device (50) includes an inner cylinder (54) through the interior of which a first liquid flow (A) flows; the inner cylinder (54) includes a cavitation generating unit (54a); the cavitation generating ejection device (50) generates cavitation in the first liquid flow (A); and the first liquid flow (A) is caused to impinge on the workpiece (W).
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Inventors:
KANNO YUYA (JP)
Application Number:
PCT/JP2023/013752
Publication Date:
November 30, 2023
Filing Date:
April 03, 2023
Export Citation:
Assignee:
FUJIKOSHI MACHINERY CORP (JP)
International Classes:
B24B37/00; B24B1/00; B24B37/10; H01L21/304
Foreign References:
| JP2003179018A | 2003-06-27 | |||
| CN107717687A | 2018-02-23 | |||
| JP2021194642A | 2021-12-27 | |||
| JPH01252361A | 1989-10-09 | |||
| JPH0647671A | 1994-02-22 | |||
| JP2017192995A | 2017-10-26 | |||
| JP2015186838A | 2015-10-29 | |||
| JP2006255865A | 2006-09-28 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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